Enabling Compact, Efficient Designs with High Voltage CoolSiC™ Discretes was generously sponsored by Mouser Electronics and Infineon.
The power electronics industry is undergoing a major shift as industrial applications push for higher efficiency, power density, and voltage levels—challenges that traditional silicon solutions struggle to meet. This eBook explores how Infineon’s CoolSiC™ technology addresses these demands head-on. With support for voltages up to 2000V and a broad RDS(on) range, CoolSiC™ devices enable engineers to design systems that are not only more efficient but also more compact and reliable. Built on a robust trench design, these devices offer key advantages such as enhanced gate oxide reliability, parasitic turn-on immunity, and simplified system integration through 0V gate-source voltage operation.
Through four core focus areas—technology evolution, enhanced performance, smart packaging, and design support—this guide provides practical insights for accelerating power design development. Readers will discover the performance gains achieved through Generation 2 devices, the thermal and electrical advantages of .XT interconnection technology, and the manufacturing benefits of the topside-cooled Q-DPAK package. With access to simulation tools and validated reference designs, engineers are empowered to shorten development cycles and bring advanced energy systems to market faster. Whether designing solar inverters, energy storage solutions, or industrial drives, this eBook shows how CoolSiC™ technology delivers the reliability, flexibility, and efficiency needed for the next generation of power electronics.
